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Heterostructural Interface Modelling, 2019: Semiconductor Electronics, Solid-State Lithium-Ion Conductor, Solid-State Devices & Thermodynamic Factors - ResearchAndMarkets.com

November 29, 2019

DUBLIN--(BUSINESS WIRE)--Nov 29, 2019--

The “Heterostructural Interface Modelling” book has been added to ResearchAndMarkets.com’s offering.

The interface structure of joined materials is a key factor in the development of high-tech components. The book reviews recent experimental and theoretical research in the area of modelling new types of joints and predicting the expected properties. Fields covered include lattice theory, semiconductor electronics, solid-state lithium-ion conductor, solid-state devices, filamentary growth of graphite, curved basal sheets of graphite, thermodynamic factors and lattice-matching criteria, minimisation of interface stresses due to misfit, epitaxial deposition, composite design, coincidence site lattice theory, ionic conductivity improvement by interfacial lattice strain, epitaxial thin-film systems, methods and software for identifying compatible material combinations. The book references 302 original resources and includes their direct web link for in-depth reading.

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About the Author

For more information about this book visit https://www.researchandmarkets.com/r/62cuwi

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SOURCE: Research and Markets

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PUB: 11/29/2019 11:40 AM/DISC: 11/29/2019 11:40 AM

http://www.businesswire.com/news/home/20191129005308/en