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Complete Teardown Analysis of Valeo’s SCALA Laser Scanner, 2019 Report - ResearchAndMarkets.com

May 15, 2019 GMT

DUBLIN--(BUSINESS WIRE)--May 15, 2019--

The “Valeo SCALA Laser Scanner” report has been added to ResearchAndMarkets.com’s offering.

Based on a complete teardown analysis of the LiDAR, the report provides the bill-of-material (BOM) and the manufacturing cost of the LiDAR sensor. The report also includes a complete physical analysis of the laser diode and the avalanche photodiode. It also features a complete cost analysis and estimates a selling price.


Highly and fully automated driving is about to become reality in the very near future. Driven by lower production costs and the emergence of new technologies, LiDAR is becoming a key component for automotive applications and we expect this market to explode, with a 64% CAGR between 2018 and 2024.

SCALA was developed via the partnership between Valeo and Ibeo. It is a mechanical 3D Scanner Laser capable of identifying objects and measuring the distance in any environment, designed for vehicles with Advanced Driver Assistance Systems (ADAS) and autonomous cars.

An embedded rotating mirror dejects the beam emitted by a high-power laser diode through an emitting lens and receives the returned reflections through a condenser lens. A three-element avalanche photodiode array then captures the reflections. The Time-of-Flight measurement of the travel time of this pulse enables the system to determine the distance from the obstacle.

The laser is a high-power pulsed laser diode based on edge-emitting laser diode technology from laser components. The three stacked active layers deliver 75W in 150ns. The laser comes in a can package.

The Time-of-Flight is measured by an avalanche photodiode array from First Sensor manufactured in silicon and assembled in a low cost Printed Circuit Board (PCB) package with a glass window. The two main optical components are assembled on the same PCB.

Key Topics Covered:

1. Overview/Introduction

  • Executive Summary
  • Main Features & Block Diagram
  • Company Profile

2. Company Profile

3. Teardown Analysis

  • Views and Dimensions of the SCALA
  • SCALA Opening
  • Main Electronic Board
  • Laser Unit Board
  • Motor Unit Board
  • Laser Diode Physical Analysis
  • Photodiode Physical Analysis
  • Lenses Physical Analysis
  • Mirror Material analysis

4. Cost Analysis

  • Main Components Cost
  • Laser Diode Cost Analysis
    • Wafer & die cost
    • Packaging and component cost
  • Photodiode Cost Analysis
    • Wafer & die cost
    • Packaging and component cost
  • PCBs Cost
  • BOM Cost - Electronic Boards & Housing
  • Material Cost Breakdown
  • Added-Value Cost Breakdowns
  • Manufacturing Cost Breakdown

5. Estimated Price Analysis

  • Estimation of the Selling Price

Companies Mentioned

  • First Sensor
  • Ibeo
  • Valeo

For more information about this report visit https://www.researchandmarkets.com/r/rgy5j1


View source version on businesswire.com:https://www.businesswire.com/news/home/20190515005581/en/

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SOURCE: Research and Markets

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PUB: 05/15/2019 09:38 AM/DISC: 05/15/2019 09:38 AM