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Die Bonder Equipment Market Expected to Grow with a CAGR of 3.5% During the Forecast Period, 2019-2024 - ResearchAndMarkets.com

November 28, 2019 GMT

DUBLIN--(BUSINESS WIRE)--Nov 28, 2019--

The “Die Bonder Equipment Market by Type (Semiautomatic Die Bonder, Fully Automatic Die Bonder), Bonding Technique, Supply Chain Participant (IDM Firms, OSAT Companies), Device, Application (Consumer Electronics), and Region - Global Forecast to 2024” report has been added to ResearchAndMarkets.com’s offering.

Die bonder equipment market is projected to grow at CAGR of 3.5% from 2019 to 2024

The global die bonder equipment market size is projected to grow from USD 820 million in 2019 to USD 972 million by 2024, at a CAGR of 3.5% from 2019 to 2024. Key factors fueling the growth of this market include the growing demand for miniature electronic components and the increasing adoption of stacked die technology in IoT devices.

Market for fully automatic die bonders is projected to grow at highest CAGR during forecast period

Among different types, fully automatic die bonders are projected to lead the market from 2019 to 2024. Fully automatic die bonders can work on different modules, such as wire bonding, wedge bonding, flip chip bonding, and die bonding. Fully automatic die bonders are required for the assembly and packaging of the high volume of consumer products. In addition, fully automatic die bonder equipment provide micron-level placement accuracy, ranging from 1.5m to 0.5m, necessary for the fabrication of electronic components used in medical devices, automobile systems, and consumer electronics, which is expected to propel the market growth in the near future.

Market for eutectic bonding technique is projected to grow at highest CAGR during 2019-2024

Among bonding techniques, the eutectic bonding technique is projected to witness the highest CAGR in the die bonder equipment market from 2019 to 2024. This technique requires higher operating temperature during the bonding process, and the bond created is not only robust but can also remain intact even in harsh environments. Semiconductor components fabricated using the eutectic bonding technique are suitable for products that are used in automotive, telecommunications, and industrial applications due to their robustness, which is expected to contribute significantly to the growth of the market for the eutectic bonding technique in the near future.

Consumer electronics application accounted for largest market share in 2018

Among applications, the consumer electronics segment is projected to lead the die bonder equipment market from 2019 to 2024. The largest market size is due to the high demand for miniaturized consumer electronic products such as smartphones, wearables, and white goods that provide advantages such as compactness and durability. These miniaturized products make use of several devices, such as optoelectronics, MEMS, and MOEMS. All these devices require die bonding equipment in the assembly process of these components.

Asia Pacific (APAC) is expected to hold largest share of die bonder equipment market in 2024

APAC is expected to hold the largest share of the die bonder equipment industry in 2024. More than 60% of OSAT players present across the world have their headquarters in the APAC region. These OSAT companies use die bonding equipment in the semiconductor fabrication process. Additionally, an increasing number of IDMs in the region is expected to boost the die bonder equipment market growth in the near future. Similarly, the mass production of electronic products, such as smartphones, wearables, and white goods, in China and Taiwan is also expected to accelerate market growth in APAC.

Reasons to buy the report

Key Topics Covered:

1 Introduction

1.1 Study Objectives

1.3 Scope

1.4 Currency

1.5 Limitations

1.6 Market Stakeholders

2 Research Methodology

2.1 Research Data

2.1.1 Secondary Data

2.1.2 Primary Data

2.2 Market Size Estimation

2.4 Research Assumptions

3 Executive Summary

4 Premium Insights

4.1 Attractive Growth Opportunities in Market

4.2 Market, By Country

4.3 Market, By Bonding Technique

4.4 Market, By Application and Region

5 Market Overview

5.1 Introduction

5.2 Market Dynamics

5.3 Value Chain Analysis

6 Die Bonder Equipment Market, By Type

6.1 Introduction

6.2 Manual Die Bonders

6.3 Semiautomatic Die Bonders

6.4 Fully Automatic Die Bonders

7 Market, By Bonding Technique

7.1 Introduction

7.2 Epoxy

7.3 Eutectic

7.4 Soft Solder

7.5 Others

8 Market, By Supply Chain Participant

8.1 Introduction

8.2 Osat Companies

8.3 IDM Firms

9 Market, By Device

9.1 Introduction

9.2 Optoelectronics

9.3 MEMS and MOEMs

9.4 Power Devices

10 Die Bonder Equipment Market, By Application

10.1 Introduction

10.2 Consumer Electronics

10.3 Automotive

10.4 Industrial

10.5 Telecommunications

10.6 Healthcare

10.7 Aerospace & Defense

11 Geographic Analysis

11.1 Introduction

11.2 APAC

11.3 Americas

11.4 EMEA

12 Competitive Landscape

12.1 Introduction

12.2 Market Ranking Analysis, 2018

12.3 Competitive Scenario

12.4 Competitive Leadership Mapping

12.5 Strength of Product Portfolio

12.6 Business Strategy Excellence

13 Company Profiles

13.1 Key Players

13.1.1 Be Semiconductor Industries N.V.

13.1.2 ASM Pacific Technology Ltd.

13.1.3 Kulicke & Soffa

13.1.4 Mycronic AB

13.1.5 Palomar Technologies, Inc.

13.1.6 West - Bond, Inc.

13.1.7 Microassembly Technologies, Ltd.

13.1.8 Finetech GmbH & Co. Kg

13.1.9 Dr. Tresky Ag

13.1.10 Smart Equipment Technology

13.2 Right to Win

13.3 Other Key Players

13.3.1 Hybond, Inc.

13.3.2 Shibuya Corporation

13.3.3 Anza Technology, Inc.

13.3.4 Paroteq GmbH

13.3.5 Tresky GmbH

13.3.6 Dias Automation (Hk) Ltd

13.3.7 Shinkawa Ltd.

13.3.8 Four Technos Co., Ltd.

13.3.9 Fasford Technology Co., Ltd.

13.3.10 Unitemp GmbH

13.3.11 Tpt Wire Bonder GmbH & Co. Kg

For more information about this report visit https://www.researchandmarkets.com/r/rqu1ko

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KEYWORD: ASIA PACIFIC

INDUSTRY KEYWORD: OTHER MANUFACTURING MANUFACTURING

SOURCE: Research and Markets

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PUB: 11/28/2019 05:20 AM/DISC: 11/28/2019 05:20 AM

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