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Global Semiconductor Silicon Wafer Market Report 2019: 2017-2018 Data & CAGR Projections through 2023 - ResearchAndMarkets.com

November 6, 2019

DUBLIN--(BUSINESS WIRE)--Nov 6, 2019--

The “Global Semiconductor Silicon Wafer Market” report has been added to ResearchAndMarkets.com’s offering.

This report forecasts the market for compound semiconductor wafers for 2018-2023. The report presents the market forecast in terms of dollar value ($ million) and shipment volume (msi).

Semiconductor wafers covered in this report include silicon and compound semiconductor materials. Stability in the ASP will be largely due to price escalation in silicon wafers in 2018-2019. Compound semiconductor wafers, on the other hand, will witness a steady decline in ASP. Silicon wafer manufacturing requires substantive investment and long gestation periods. Consequently, there are only a few wafer manufacturers large enough to influence pricing. The rest cater mainly to niche markets.

Another pertinent observation is that the scale of operations in silicon wafers is substantially higher than in compound semiconductors. The ASP of silicon wafers is also much lower. There is an ever-growing pressure on silicon availability due to demand from the solar/photovoltaic (PV) cell industry. Superior material properties of specific compound semiconductors have prompted designers to increasingly look toward compound semiconductors.

The low ASP of silicon wafers is primarily due to the abundant availability of silicon for compound semiconductors; notwithstanding the pressure exerted by solar/PV cell industry. It should also be remembered that compound semiconductors are in demand in the solar/PV cell industry, though not to the same extent as silicon. There is an additional factor that lowers the ASP of silicon wafers. Presently, silicon wafers, alone, are available in 300 mm diameters, commercially.

This is in sharp contrast to compound semiconductors. Even 200 mm wafer sizes are yet to achieve mainstream status. Greater diameters translate into greater surface area. This ultimately translates into greater yield. While the requirement for semiconductor materials increases proportionally to the square of the ratio of diameters; materials account for only a fraction of the overall manufacturing process cost. Other contributing factors to the manufacturing cost do not increase it to the same extent.

It is always attractive, operationally, to work with larger diameters. The advantage of working with larger diameters is more pronounced for silicon wafers as the basic material cost is lower than that of compound semiconductors. Consequently, a comparable increase in yield is achieved with much lower incremental costs for silicon, compared to compound semiconductors.

For ASP movement, wafer manufacturers have historically resorted to a steady annual reduction in wafer prices followed by an occasional rise (once every few years) in response to rising input costs. This spike in prices is followed by a steady decline, yearly, which is expected as the input costs stabilize and manufacturers benefit from the depreciation of equipment. The spike in prices in 2018-2019 however, is expected to be sharp enough to keep prices on an even keel in 2023, compared to 2018 levels.

Report Includes:

Key Topics Covered:

Chapter 1 Introduction

Chapter 2 Executive Summary

Chapter 3 Semiconductor Device Manufacturing and Material Properties

Chapter 4 Crystal Growth Methods

Chapter 5 Wafer-Bonding Process

Chapter 6 Node Sizes

Chapter 7 Regional Markets

Chapter 8 Global Markets

Chapter 9 Patent Analysis

Chapter 10 Company Profiles

For more information about this report visit https://www.researchandmarkets.com/r/juwl7p

View source version on businesswire.com:https://www.businesswire.com/news/home/20191106005708/en/

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SOURCE: Research and Markets

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PUB: 11/06/2019 10:55 AM/DISC: 11/06/2019 10:55 AM