Click to copy
Press release content from Business Wire. The AP news staff was not involved in its creation.
Click to copy
PRESS RELEASE: Paid content from Business Wire
Press release content from Business Wire. The AP news staff was not involved in its creation.

Global Advanced Packaging Technologies Market Analysis Report 2019 - ResearchAndMarkets.com

February 14, 2019

DUBLIN--(BUSINESS WIRE)--Feb 14, 2019--The “Global Advanced Packaging Technologies Market Analysis 2019” report has been added to ResearchAndMarkets.com’s offering.

The Global Advanced Packaging Technologies Market is expected to grow at a CAGR of 9.3% during the forecast period.

Advanced packaging techniques use an integrated circuit (IC), which is encapsulated in a supporting case that prevents physical damage and corrosion of the metallic parts. Advanced packaging technologies include BGA, Flip-Chip, CSP, LGA, PGA and their derivate.

These advanced-packaging technologies promise greater chip connectivity and lower power consumption compared with traditional packaging configurations. Growing trend of miniaturization is favouring the market growth. Lack of standardization will restrain the market growth.

By technology, active packaging is gaining traction for food packaging applications due to its properties that enhance shelf life and the ability to reflect properties of contained food on the packaging.

Key Questions Answered in this Report:

  • How this market evolved since the year 2016
  • Market size estimations, forecasts and CAGR for all the segments presented in the scope
  • Key Market Developments and financials of the key players
  • Opportunity Analysis for the new entrants
  • SWOT Analysis of the key players
  • Fastest growing markets analysed during the forecast period.

Key Topics Covered:

1 Market Synopsis

2 Research Outline

2.1 Research Snapshot

2.2 Research Methodology

2.3 Research Sources

3 Market Dynamics

3.1 Drivers

3.2 Restraints

4 Market Environment

4.1 Bargaining power of suppliers

4.2 Bargaining power of buyers

4.3 Threat of substitutes

4.4 Threat of new entrants

4.5 Competitive rivalry

5 Global Advanced Packaging Technologies Market, By Technology

5.1 Introduction

5.2 Smart and Intelligent Packaging

5.3 Active Packaging

6 Global Advanced Packaging Technologies Market, By End User

6.1 Introduction

6.2 Pharmaceuticals

6.3 Cosmetics & Personal Care

6.4 Beverages

6.5 Food

6.6 Agriculture

6.7 Industrial & Chemicals

6.8 Other End Users

7 Global Advanced Packaging Technologies Market, By Geography

7.1 Introduction

7.2 North America

7.3 Europe

7.4 Asia Pacific

7.5 South America

7.6 Middle East & Africa

8 Strategic Benchmarking

9 Vendors Landscape

9.1 3M Company

9.2 Crown Holdings, Inc.

9.3 Amcor Limited

9.4 PakSense Inc.

9.5 Thin Film Electronics ASA

9.6 CCL Industries Inc.

9.7 Sealed Air Corporation

9.8 Vitsab International AB

9.9 Landec Corporation

9.10 Timestrip U.K. Ltd.

9.11 LCR Hallcrest LLC

9.12 Bemis Company, Inc.

9.13 Temptime Corporation

9.14 Cryolog S.A.

9.15 SYSCO Corporation

For more information about this report visit https://www.researchandmarkets.com/research/c84nrv/global_advanced?w=4

View source version on businesswire.com:https://www.businesswire.com/news/home/20190214005455/en/

CONTACT: ResearchAndMarkets.com

Laura Wood, Senior Press Manager


For E.S.T Office Hours Call 1-917-300-0470

For U.S./CAN Toll Free Call 1-800-526-8630

For GMT Office Hours Call +353-1-416-8900

Related Topics:Packaging



SOURCE: Research and Markets

Copyright Business Wire 2019.

PUB: 02/14/2019 07:50 AM/DISC: 02/14/2019 07:50 AM


All contents © copyright 2019 The Associated Press. All rights reserved.