Global MEMS Packaging Market Outlook, 2019-2024 - Growing Adoption of Smartphones & Connected Devices to Drive Demand - ResearchAndMarkets.com
DUBLIN--(BUSINESS WIRE)--Nov 29, 2019--
The “MEMS Packaging Market - Growth, Trends, and Forecast (2019 - 2024)” report has been added to ResearchAndMarkets.com’s offering.
The global MEMS packaging market is projected to grow at a CAGR of 17.8% during the forecast period 2019-2024.
Owing to the increase in global demand for smart automotive solutions, the demand for MEMS packaging market is also expected to go up. The increasing market demand for connected devices and consumer electronics is expected to drive the market for sensors. Global industrial sensor usage is soaring due to the ever-increasing applications of sensors and government regulations, which in turn is expected to drive the demand for MEMs packaging. Gaming industry’s growth is also likely to influence the market.
Key Market Trends
Growing Adoption of Smartphones & Connected Devices is Expected to Drive Demand
North America Holds the Major Share of the Market
The MEMS packaging market is moving towards consolidation format as the industry is capital intensive and major vendors in the market are banking on diverse product portfolio and product development to gain an edge and the innovation capabilities of any player are dependent on the investments into R&D. The industry’s capital intensive nature poses an entry barrier to new entrants. Key players are ChipMos Technologies Inc., AAC Technologies, Bosch Sensortec GmbH, Infineon Technologies AG, Analog Devices, Inc., etc.
Recent market development:
Key Topics Covered
1.1 Scope of the Study
1.2 Key Study Deliverables
1.3 Study Assumptions
2 RESEARCH METHODOLOGY
3 EXECUTIVE SUMMARY
4 MARKET DYNAMICS
4.1 Market Overview
4.2 Introduction to Market Drivers
4.3 Market Drivers
4.3.1 Growing Smart Automotive Market
4.3.2 Increasing Smart Phone Adoption Rate & Connected Devices
4.3.3 Sensor Usage in Industries
4.4 Market Restraints
4.4.1 Complex Manufacturing Process
4.5 Industry Attractiveness - Porter’s Five Force Analysis
4.5.1 Bargaining Power of Suppliers
4.5.2 Bargaining Power of Buyers
4.5.3 Threat of New Entrants
4.5.4 Threat of Substitute Products
4.5.5 Intensity of Competitive Rivalry
4.6 Technology Snapshot
5 MARKET SEGMENTATION
5.1 By Sensor Type
5.1.1 Inertial Sensor
5.1.2 Optical Sensor
5.1.3 Environmental Sensor
5.1.4 Ultrasonic Sensor
5.1.5 RF MEMS
5.1.6 Other Sensor Types
5.2 By End User
5.2.2 Mobile Phones
5.2.3 Consumer Electronics
5.2.4 Medical Systems
5.2.6 Others End Users
5.3.1 North America
5.3.3 Asia Pacific
5.3.4 Rest of the World
6 COMPETITIVE LANDSCAPE
6.1 Company Profiles
6.1.1 ChipMos Technologies Inc.
6.1.2 AAC Technologies Holdings Inc.
6.1.3 Bosch Sensortec GmbH
6.1.4 Infineon Technologies AG
6.1.5 Analog Devices, Inc.
6.1.6 Texas Instruments Incorporated
6.1.7 Taiwan Semiconductor Manufacturing Company Limited
6.1.9 Orbotech Ltd.
6.1.10 TDK Corporation
7 INVESTMENT ANALYSIS
8 MARKET OPPORTUNITIES AND FUTURE TRENDS
For more information about this report visit https://www.researchandmarkets.com/r/wen7uw
View source version on businesswire.com:https://www.businesswire.com/news/home/20191129005178/en/
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INDUSTRY KEYWORD: PACKAGING MANUFACTURING
SOURCE: Research and Markets
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PUB: 11/29/2019 06:29 AM/DISC: 11/29/2019 06:29 AM