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Introduction to Spacecraft Thermal Design. Cambridge Aerospace Series Part No. 48: Thermal Circuits, MLI & Limiting Resistance - ResearchAndMarkets.com

November 22, 2019

DUBLIN--(BUSINESS WIRE)--Nov 22, 2019--

The “Introduction to Spacecraft Thermal Design. Cambridge Aerospace Series Part No. 48” book has been added to ResearchAndMarkets.com’s offering.

Develop a fundamental understanding of heat transfer analysis techniques as applied to earth based spacecraft with this practical guide. Written in a tutorial style, this essential text provides a how-to manual tailored for those who wish to understand and develop spacecraft thermal analyses. Providing an overview of basic heat transfer analysis fundamentals such as thermal circuits, limiting resistance, MLI, environmental thermal sources and sinks, as well as contemporary space based thermal technologies, and the distinctions between design considerations inherent to room temperature and cryogenic temperature applications, this is the perfect tool for graduate students, professionals and academic researchers.

Key Topics Covered:

1. Introduction;

2. Conduction heat transfer analysis;

3. Radiation heat transfer analysis;

4. The space environment;

5. Space-based advanced thermal conductance and storage technologies;

6. Sensors, instrumentation, and test support hardware;

7. Fundamentals of cryogenics;

8. Developmental and environmental testing

Authors

Eric Silk NASA-Goddard Space Flight Center.

Dr. Eric A. Silk is a Senior Lecturer in the Aerospace Engineering Department at the University of Maryland, College Park with 22 years of engineering experience in thermal system design and analysis for space based systems and serves.

For more information about this book visit https://www.researchandmarkets.com/r/r2rms

View source version on businesswire.com:https://www.businesswire.com/news/home/20191122005197/en/

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KEYWORD:

INDUSTRY KEYWORD: AEROSPACE MANUFACTURING

SOURCE: Research and Markets

Copyright Business Wire 2019.

PUB: 11/22/2019 06:15 AM/DISC: 11/22/2019 06:15 AM

http://www.businesswire.com/news/home/20191122005197/en