Global 3D IC Market 2019-2023 | Increasing Interest Toward the HBM Chip to Boost Growth | Technavio
LONDON--(BUSINESS WIRE)--Nov 13, 2019--
The global 3D IC market is expected to post a CAGR of 18% during the period 2019-2023, according to the latest market research report by Technavio. Request a free sample report
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Technavio has announced its latest market research report titled global 3D IC market 2019-2023 (Graphic: Business Wire)
The growing demand for augmented device memory is compelling OEMs of smartphones, tablets, personal computers, personal digital assistants (PDAs), and notebooks to launch new products integrated with 3D NAND. Vendors of 2D NAND are also shifting their focus toward the production of 3D NAND. 3D NAND flash drives also find many applications in IoT devices and smart cars. The growing need for better memory in devices is expected to positively influence the growth of the global 3D IC market during the forecast period.
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As per Technavio, the increasing interest toward HBM chips will have a positive impact on the market and contribute to its growth significantly over the forecast period. This research report also analyzes other important trends and market drivers that will affect market growth over 2019-2023.
Global 3D IC Market: Increasing Interest Toward HBM Chip
High bandwidth memory (HBM) chips are high-density multi-die 3D ICs that have a stacked memory chip configuration, thus enabling faster data transfer, providing higher bandwidths, and lowering power consumption. Growing need for faster and energy-efficient chips will drive the demand for HBM chips, which in turn will boost market growth during the forecast period.
“Growing demand for 14-nm/16nm FinET technology and the growth of smart cities will further boost market growth during the forecast period”, says a senior analyst at Technavio.
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Global 3D IC Market: Segmentation Analysis
This market report segments the global 3D IC market by products (memory, LEDs, sensors, and MEMs) and geography (APAC, Europe, MEA, North America, and South America).
The APAC region led the market in 2018, followed by North America, Europe, South America, and MEA, respectively. During the forecast period, the APAC region is expected to maintain its dominance over the global market. This is due to increasing investments in the construction of new fabs in the region and increasing demand for ICs from several end-user industries such as automotive and consumer electronics.
Technavio’s sample reports are free of charge and contain multiple sections of the report, such as the market size and forecast, drivers, challenges, trends, and more.
Some of the key topics covered in the report include:
- Market ecosystem
- Market characteristics
- Market segmentation analysis
- Market definition
- Market size and forecast
Five Forces Analysis
- Geographic comparison
- Key leading countries
- Landscape disruption
- Competitive scenario
- Vendors covered
- Vendor classification
- Market positioning of vendors
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