Innovations in Radar-on-Chip, Wireless Electric Vehicle Charging Systems, Artificial Intelligence, and In-vehicle Sensing Solutions, 2019 Study - ResearchAndMarkets.com
DUBLIN--(BUSINESS WIRE)--Dec 18, 2019--
The “Innovations in Radar-on-Chip, Wireless Electric Vehicle Charging Systems, Artificial Intelligence, and In-vehicle Sensing Solutions” report has been added to ResearchAndMarkets.com’s offering.
This Mobility TechVision Opportunity Engine (TOE) profiles advancements in radar-on chip, electric vehicle charging, AI chipsets, 5G communication, wearables, in-vehicle sensing and LiDAR solutions, autonomous vehicles, connected vehicles, and cybersecurity.
The purpose of the Mobility Technology TOE is to raise awareness of global technology innovations in self-propelled ground-based mobile platforms that are not only technically significant but potentially offering commercial value. Each monthly TOE provides subscribers valuable descriptions and analyses of 10 noteworthy innovations. The main focus is on highway-licensed motor vehicles (light, medium and heavy).
Passenger cars, trucks, buses, motorcycles, scooters and railway locomotives are within the product scope, energized by any fuel. Many of the innovations concern powertrains (internal combustion engines, turbines, battery electrics, fuel cell electrics, hybrid-electrics), as well as drivetrains (including transmissions), interiors seating and displays, advanced materials as for body/chassis, wireless connectivity, and self-driving technology that is currently receiving so much attention. The A&T TOE outlines and evaluates each innovation, notes which organizations and developers are involved, projects the likely timing for commercialization, furnishes a patent analysis and provides valuable strategic insights for industry stakeholders.
The Advanced Manufacturing and Automation (AMA) Cluster covers technologies that enable clean, lean and flexible manufacturing and industrial automation. Technologies such as three-dimensional (3D) and four-dimensional (4D) printing, wireless sensors and networks, information and communication technology, multi-material joining, composites manufacturing, digital manufacturing, micro- and nano-manufacturing, lasers, advanced software, and printing techniques, are covered as part of this cluster.
The technologies covered here impact a wide range of industries, such as the impact semiconductor, automotive and transportation, aerospace and defense, industrial, healthcare, logistics, and electronics industries.
Key Topics Covered:
For more information about this report visit https://www.researchandmarkets.com/r/61q6cl
View source version on businesswire.com:https://www.businesswire.com/news/home/20191218005386/en/
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SOURCE: Research and Markets
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PUB: 12/18/2019 07:29 AM/DISC: 12/18/2019 07:29 AM