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Press release content from Business Wire. The AP news staff was not involved in its creation.

Amtech Announces Record New Orders for Advanced Reflow Systems

March 9, 2021 GMT
(Photo: Business Wire)
(Photo: Business Wire)

TEMPE, Ariz.--(BUSINESS WIRE)--Mar 9, 2021--

Amtech Systems, Inc. (NASDAQ: ASYS), a manufacturer of capital equipment, including thermal processing and wafer polishing, and related consumables used in fabricating semiconductor devices, such as silicon carbide (SiC) and silicon power devices, analog and discrete devices, electronic assemblies and light-emitting diodes (LEDs), announced today strong order momentum for its PYRAMAX™ reflow systems sold into advanced packaging applications.

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(Photo: Business Wire)

The new orders were from several customers and included multi-unit follow-on orders from leading multi-national advanced packaging OSATs in the Asia Pacific region. These orders include PYRAMAX TrueFlat™ convection reflow ovens used to eliminate warpage for very thin substrates in advanced packaging applications.

“We continue to see strong bookings with an increase in activity from strategic accounts globally, especially from key Asian advanced packaging companies,” said Michael Whang, Chief Executive Officer of Amtech. “Customer need drove the development of the Pyramax TrueFlat system, and we continue to work with key customers to add new capabilities to the TrueFlat system that will expand its use in the marketplace,” added Mr. Whang.

The PYRAMAX family of high-throughput convection reflow ovens is widely recognized as the global standard of excellence for both printed circuit board solder reflow and for semiconductor packaging. The Pyramax features an exclusive closed loop convection control and process temperatures up to 400°C. For the most demanding applications, PYRAMAX can provide O 2 levels as low as 2ppm above source in the peak reflow zone. The PYRAMAX TrueFlat is designed for very thin substrates of 0.15mm to 0.30mm, ensuring flatness throughout the heating and cooling process – eliminating die tilt.

For more information, visit www.amtechsystems.com.

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About Amtech Systems, Inc.

Amtech Systems, Inc. is a global supplier of advanced thermal processing and polishing equipment and related consumables to the semiconductor / electronics, power IC businesses, and advanced lighting manufacturing markets. Amtech’s equipment includes diffusion, solder reflow systems, and polishing equipment and related consumables for surface preparation of various materials, including silicon carbide (“SiC”), sapphire and silicon. The Company’s thermal processing, polishing and consumable products currently address the diffusion, oxidation, and deposition steps used in the fabrication of semiconductors, printed circuit boards, semiconductor packaging, MEMS, and advanced lighting, including the polishing of newly sliced sapphire and silicon wafers. Amtech’s products are recognized under the leading brand names BTU International, Bruce Technologies TM, and PR Hoffman TM.

Cautionary Note Regarding Forward-Looking Statements

Certain information contained in this press release is forward-looking in nature. All statements in this press release, or made by management of Amtech Systems, Inc. and its subsidiaries (“Amtech”), other than statements of historical fact, are hereby identified as “forward-looking statements” (as such term is defined in Section 27A of the Securities Act of 1933, as amended, and Section 21E of the Securities Exchange Act of 1934, as amended). The forward-looking statements in this press release relate only to events or information as of the date on which the statements are made in this press release. Examples of forward-looking statements include statements regarding Amtech’s future financial results, operating results, business strategies, projected costs, products under development, competitive positions, plans and objectives of Amtech and its management for future operations, efforts to improve operational efficiencies and effectiveness and greater China sourcing. In some cases, forward-looking statements can be identified by terminology such as “may,” “will,” “should,” “would,” “expects,” “plans,” “anticipates,” “intends,” “believes,” “estimates,” “predicts,” “potential,” “continue,” or the negative of these terms or other comparable terminology used in this press release or by our management, which are intended to identify such forward-looking statements. These statements are not guarantees of future performance and involve risks, uncertainties and assumptions that are difficult to predict. The Form 10-K that Amtech filed with the Securities and Exchange Commission (the “SEC”) for the year-ended September 30, 2020, listed various important factors that could affect the company’s future operating results and financial condition and could cause actual results to differ materially from historical results and expectations based on forward-looking statements made in this document or elsewhere by Amtech or on its behalf. These factors can be found under the heading “Risk Factors” in the Form 10-K and investors should refer to them. Because it is not possible to predict or identify all such factors, any such list cannot be considered a complete set of all potential risks or uncertainties. Except as required by law, we undertake no obligation to publicly update forward-looking statements, whether as a result of new information, future events, or otherwise.

View source version on businesswire.com:https://www.businesswire.com/news/home/20210309005567/en/

CONTACT: Amtech Systems, Inc.

Lisa D. Gibbs

Chief Financial Officer

(480) 360-3756

irelations@amtechsystems.comSapphire Investor Relations, LLC

Erica Mannion and Mike Funari

Investor Relations

(617) 542-6180

irelations@amtechsystems.com

KEYWORD: UNITED STATES NORTH AMERICA ARIZONA

INDUSTRY KEYWORD: TECHNOLOGY HARDWARE SEMICONDUCTOR

SOURCE: Amtech Systems, Inc.

Copyright Business Wire 2021.

PUB: 03/09/2021 07:30 AM/DISC: 03/09/2021 07:31 AM

http://www.businesswire.com/news/home/20210309005567/en